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Ocolour Technologies Co., Limited
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COB Transparent LED Screen Wall 3.91 x 7.82 Pixel Pitch With Asynchronous

COB Transparent LED Screen Wall 3.91 x 7.82 Pixel Pitch With Asynchronous

Brand Name : Ocolour
Model Number : OC-WQ-P3.91x7.82COB
Certification : CE, ETL,ROHS, CCC
Place of Origin : China
Price : Negotiable
Payment Terms : T/T, L/C, Western Union
Supply Ability : 5000sq.meter/month
Delivery Time : 15-20 working days
Packaging Details : Plywood case
Pixel pitch : 3.91x7.82
LED lamp : COB
Module size : 500x500mm
Drive mode : 1/8 scan
Control way : asynchronous
Power input : AC 110V /220V
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COB Packaging Challenges Outdoor Small Pitch New Limits & SMD Packaging Will Face Great Challenges

COB packaging has gradually matured in the field of LED display applications, especially in the field of outdoor small pitch with its unique technological advantages have emerged, has now exceeded the outdoor P3.0 level, and in the near future to break through the outdoor P2.0 level is inevitable . So what is the COB packaging technology? Why is it so impressive to see the emergence of an Egyptian? Where is its technical advantage? What are the application prospects of future COB products?

I. What is COB packaging?

COB package in English is called Chip On Board, literal translation is the chip on the board. as the picture shows:

In the field of LED display technology, the COB packaging process is to fix LED bare die with conductive adhesive or insulating adhesive on the pad of the PCB's lamp position, and then use ultrasonic welding technology to conduct lead bonding of the LED chip, and finally use epoxy. The resin glue encapsulates the lamp position and protects the LED light-emitting chip.

II. The difference between COB packaging process and DIP and SMD packaging process

The DIP and SMD packaging processes are no different from COB encapsulation in terms of die bonding wires. The biggest difference is in the use of red brackets. As we all know, the bracket has four solder legs that need to be soldered to the PCB board by SMT. Therefore, the biggest difference between the COB packaging process and the DIP and SMD packaging process is the elimination of a lamp surface over-reflow soldering process.

III. The advantages of COB packaging technology

1. High reliability:

An important indicator for evaluating reliability is the failure rate:

The current national standard applied in the LED display industry is: 3/10000;

COB packaging process can make this indicator achieve:

Full color screen: less than 100,000; single, dual color screen: less than 8 parts per million;

Why COB packaging display has such high reliability, we analyze through the following five points:

A: The number of control loops in the single lamp production process is reduced.

As we all know, a full-color lamp requires five wires:

The COB packaging process only needs to control the quality of the five bonding wires in the production process. In addition to the quality of the five bonding wires, the SMD process needs to be controlled, and it is necessary to control the soldering of the four soldering legs of the support when the lamp surface is reflowed quality, as shown:

According to the principle of reliability, the fewer control links in a system, the higher the reliability. The control links for COB and SMD are 5 and 9, respectively, so the reliability of SMD is at least nearly twice as low as COB in this respect.

If one square meter of P10 is produced, the SMD packaging process requires an additional 40,000 control points. If the pixel density is reduced by a factor of two, that is, the spot density reaches the P5 level, the SMD packaging process requires 160,000 solder joints per square meter to be controlled. If the pixel density is further reduced to the P2 level, the SMD packaging process requires 1 million solder joints per square meter to be controlled. How to ensure that 1 million solder joints do not exhibit false soldering, continuous soldering, and false soldering under the condition of P2 dot pitch is a very serious problem.

The COB packaging process has created a revolutionary step and has eliminated the welding of this bracket.

B. COB eliminates the lamp bead surface reflow process and there is no microscopic damage to the LED chip and wire caused by the high temperature in the reflow oven.

The SMD lamp needs to be surface-mounted and soldered to the PCB board, so the oven is subjected to a test temperature of 240°C. If the epoxy resin TG point is too low, the high temperature causes a sharp increase in the coefficient of thermal expansion of the colloid. Destruction failure of LED conductive wire. In addition, the possibility that the high temperature is transmitted to the chip through the stent pin to cause crystal fragmentation failure increases.

C. The COB packaging process directly fixes the bare LED chip to the pad, so the heat dissipation area is larger than the SMD, the thermal conductivity is also high, and the heat dissipation is good.

The SMD is to fix the LED bare chip on the pad inside the bracket. The pad needs to transfer heat to the PCB board through the bracket metal pin.

D. The COB packaging process circuit board adopts a gold-immersed process, and does not adopt the SMD-packaged PCB board spraying process, so the anti-oxidation capability of the PCB board circuit is high.

E. COB packaging process lamp surface curve is semi-spherical, as shown:

The SMD has a quadrangular shape with sharp edges and corners. COB has no shadow area and no processing dead corner when the outdoor nano-coating, anti-ultraviolet coating and three anti-paint spraying outdoor protection treatment process are performed. And SMD is faced with a huge challenge in how to deal with the antioxidant capacity of these millions of solder joints when dealing with the outdoor protection of four-legged or six-legged pads on surface-mounted lamp beads.

2. Cost cut down

Compared with the SMD packaging process, COB packaging process saves costs, mainly from the following four aspects:

A. Saving raw material costs

COB packages no longer use metal materials such as brackets and braids;

B. Save process costs

The COB package saves the cutting, splitting, braiding, and lamp reflow processes of the lamp bead circuit board;

C. Save on transportation costs

The COB package no longer uses brackets, saving the weight of the bracket. For example, a square meter of SMD P3 full color screen will use 111111 brackets.

The COB package uses a point-by-point precise dispensing process to protect the bare LED chips. Therefore, the amount of glue used is very small. Take P3 full-color as an example. The amount of glue used by a 1024-lamp module is less than 3 grams. Therefore, the weight of the module is also saved.

Save on weight saves logistics costs;

D. Simplified production organization process

The COB packaging process integrates the production processes of the midstream and downstream companies in the LED display industry chain. Within a company, it can complete the production process from encapsulation of LED light beads to LED display screens, saving the cost of production organization, and packaging and intermediate links, logistics costs, quality control costs, etc.

The SMD packaging process is the lamp packaging factory will do a good job of lamp encapsulation, and transportation to LED display production enterprises.

3. Easy to achieve small pixel pitch

For the application trend of small pitch led display, it is possible to break through the P1.0 level in the future. If only from the perspective of reliability, the advantages of the COB packaging process are much stronger than those of the SMD packaging process. The reasons are as follows.

Take the P1.0 level as an example: The P1.0 pixel density per square meter is calculated as follows:


For 1 million points, with 4 legs for each point, the total production process needs to control 4 million feet. This will be very difficult, and the COB package will not have such difficulties, so it is reliable. Also, the COB package is no longer limited by the size of the bracket when designing the lamp diameter, as shown in the following figure:

The current technology can design the lamp pixel pitch to 1.2mm, and the safety distance between the lamp distance and the lamp distance can reach 0.5mm. In theory, the small pixel pitch can achieve P1.7 level. In the future, with the advancement of LED chip technology, the size will further shrink, or there will be the emergence of flip chip LED chips. Breaking through the P1.0 level is no longer a dream.

4. Thin 180° wide viewing angle

A. Thin and light:

The COB package module will weigh less than 1/2 the weight of the SMD package module.

Compared with outdoor modules with the same density, the COB module is about 10kg lighter per square meter than the SMD module.

B. 180° wide viewing angle

Since the COB package uses a hemispherical lens to emit light, there is no masking of the face, so in theory the light emission angle can reach 180°.

The SMD is generally at 125° and can reach up to about 160°.

C. Flexible

Because the COB package is not brazed and the LED chip is sealed by the epoxy resin in the lamp position, it can be arbitrarily bent. The bending capacity is determined by the size of the module and the thickness of the PCB. The SMD module cannot be bent.

5. Compression resistance, impact resistance, wear resistance, easy to clean

A. Compression resistance, impact resistance, wear resistance

The lamp position of the COB module is encapsulated with epoxy resin, and the high TG point glue has good physical properties as follows:

Compressive strength: 8.4kg/mm2

Shear strength: 4.2kg/mm2

Impact strength: 6.8kg*cm/cm2

Hardness: Shore D 84

Take P4 lamp beads as an example: Lamp diameter is D=2.8mm

The lamp bead package area is: S=πr2=3.14X1.42=6.15mm2

The individual lamp beads withstand the pressure: 6.15X8.4=51.66kg

The individual lamp beads withstand the lateral shear force: 6.15X4.2 = 25.83kg

B. Easy to clean

Because the mask of the COB module lamp panel is no longer used, it can be directly washed with water after being used outdoors for a period of time after the pollution.

IV. in conclusion

In the future application fields of small-pitch LED display products, SMD will face enormous challenges in terms of reliability, achieving smaller pixel pitch, and cost. COB packaging will have a revolutionary breakthrough and will eliminate the big burden of brackets. COB encapsulation has a much bright future.

Technical parameters:

Module compositionPixel structureCOB 3-in-1
Pixel composition1R1G1B
Lamp diameter2.4mm
Pixel pitch3.91x7.82mm
Module resolution16×64
Module size125(W)×250(H)×12(D)
Module weight0.03KG
Module maximum power consumption21W
Cabinet compositionCabinet module composition4×2
Cabinet resolution64×128
Cabinet size500(W)×500(H)× 70(D)
Cabinet area0.25sq.m
Cabinet weight3.5kg/panel
Cabinet Pixel density8192pixels/sq.m
Cabinet Smoothness≤1mm
Cabinet formDie-cast aluminum Cabinet
Optical parametersWhite balance≥1800-2500nits
Viewing angle(Level / vertical)≥170/170
max power consumption(W/ Cabinet;W/m2)168/672
aver power consumption(W/ Cabinet;W/m2)67/269
Power requirementsAC90~264V
Processing performanceChange frame frequency(Hz)50&60
Scan mode8S
Gray level16384
Refresh rate(Hz)≥1920
Color processing bits8bit
Use parametersService life(hrs)50,000H
Working temperature / humidity(℃/RH)-40 – 80 / 10%-90%RH
waterproof levelIP65
Lamp beads compression Forward / Lateral(KG)38/19
Lamp beads wear-resistantD84
application environmentwindow displayTransparent,waterproof
stage displayHigh Transparent
rental displayThin and light,Wear-resistant,Not afraid of bumping
landscape displayFor fountain,waterproof
advertising led posterUltra-thin and ultra-light,Easy to install

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